Show simple item record

dc.contributor.authorHo, Li Ngee, Dr.
dc.contributor.authorHiroshi, Nishikawa
dc.date.accessioned2015-03-24T04:44:40Z
dc.date.available2015-03-24T04:44:40Z
dc.date.issued2014-09
dc.identifier.citationJournal of Materials Engineering and Performance, vol. 23(9), 2014, pages 3371-3378en_US
dc.identifier.issn1059-9495
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
dc.descriptionLink to publisher's homepage at http://www.asminternational.org/en_US
dc.description.abstractIn this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were investigated. Significant difference could be observed in the electrical resistivity and shear strength of ECA prepared with different amount of diethyl carbitol. Reduced electrical resistivity was found in ECAs prepared with addition of tertiary amines, but no obvious change was observed in the shear strength of the ECA joint. Rheological property of the ECA paste was investigated in order to understand the correlation of the viscosity of ECA paste and electrical resistivity and shear strength of ECA joint. Results revealed that decrease in viscosity of the ECA paste reduced electrical resistivity and enhanced shear strength of ECA joint. A Cu-filled polyurethane-based ECA with considerably low electrical resistivity at the magnitude order range of 10-3 Ωcm, and significantly high shear strength (above 17 MPa) could be achieved.en_US
dc.language.isoenen_US
dc.publisherASM Internationalen_US
dc.subjectConductive adhesiveen_US
dc.subjectCopperen_US
dc.subjectElectrical resistivityen_US
dc.subjectShear strengthen_US
dc.subjectViscosityen_US
dc.titleCopper-filled electrically conductive adhesives with enhanced shear strengthen_US
dc.typeArticleen_US
dc.identifier.urlhttp://link.springer.com/article/10.1007%2Fs11665-014-1115-4
dc.contributor.urllnho@unimap.edu.myen_US
dc.contributor.urlnisikawa@jwri.osaka-u.ac.jpen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record