Browsing Vithyacharan Retnasamy by Author "rcharan@unimap.edu.my"

Now showing items 1-3 of 3

    • Bump height at low temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
      The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...

    • Heart Caring "Handy" - Prototype 

      Retnasamy, Vithyacharan; R., Vijenthi; Sazali, Yaacob, Prof. Dr.; R., Nagarajan; Rizon, Juhari; Kenneth, Sundaraj; Shukry, Abd. Majid; Mohamad Hanif, Abd Hamid (Malaysian Invention and Design Society (MINDS), 2006-05-19)
      "Heart Carrying Handy" is designed to detect early abnormality in the heart pulse which will be deemed as a pre-heart attack sympton.

    • Wire bond shear test simulation 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...