Browsing Vithyacharan Retnasamy by Title
Now showing items 53-54 of 54
-
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ... -
WSS investigation in microfluidic FFS channel at Re 500
(Trans Tech Publications, 2014-01)Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...