Browsing Vithyacharan Retnasamy by Title
Now showing items 17-36 of 54
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Heat sink fin number variation analysis on single chip high power LED
(Trans Tech Publications, 2014-01)Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ... -
Height measurement based on fringe projection
(Trans Tech Publications, 2014)A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ... -
High power LED heat dissipation analysis via copper diamond slug
(AENSI Publisher All rights reserved, 2013-10)The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ... -
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
(Trans Tech Publications, 2014)This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ... -
Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3
(AENSI Publisher All rights reserved, 2013-10)It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ... -
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ... -
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
(Emerald Group Publishing Limited, 2013)Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ... -
LED heat dissipation analysis using composite based cylindrical slug
(Trans Tech Publications Inc., 2014-02)The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ... -
LED heat dissipation study using different Cu slug size
(AENSI Publisher All rights reserved, 2013-10)High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ... -
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ... -
Main effects study on plasma etched aluminium metallization
(Trans Tech Publications, 2014-01)Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ... -
Micro-reservoir depth determination with Twyman-Green Interferometer
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)A micro-reservoir is fabricated on transparent silica wafer using Reactive Ion Etching (RIE). The depth of the micro-reservoir has been measured using profilometer, Atomic Force Microscopy (AFM) and Twyman Green-Interferometer. ... -
Microchannel miter bend effects on pressure equalization and vortex formation
(Springer-Verlag, 2011)Simulations have been carried out for water flow in a square microchannel with a miter bend. The simulation considered a pressure-driven flow in a channel-hydraulic diameter of 5 μm for series of Reynolds number (Re) range ... -
Microfluidic channel depth determination with Tywman-Green interferometer
(Springer-Verlag London., 2013-07)A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ... -
Natural heat convection analysis on cylindrical Al slug of LED
(Trans Tech Publications, 2014-01)This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ... -
Numerical analysis of velocity profile in a FFS microchannel
(AENSI Publisher All rights reserved, 2013-10)Manipulation of the fluid flow behavior in microfluidic with precision technique is crucial to satisfy the needs of miniaturized systems. Velocity measurement is one of the physical phenomena plays significant role to ... -
Operating temperature analysis of LED with cylindrical Cu slug
(Trans Tech Publications, 2014-01)High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ... -
Phase-map fringe pixel tracing for height computation
(Institute of Electrical and Electronics of Engineering (IEEE), 2010-10-03)Fringe projection coupled with phase map generation has been used extensively for various applications namely in quality control sector of the industrial field. A phase map is generated from a multiple fringe projected ... -
Physical characterization of BST with different (x') ratios
(Trans Tech Publications, 2014)Nowdays Barium strontium titanate (BST) can be applied into many fields of engineering. Its properties attracted more researchers to research and apply it into many fields of study. In this work, sol-gel method of preparing ... -
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...