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Now showing items 31-40 of 51
Cylindrical shape slug heat conduction numerical analysis using copper material
(AENSI Publications, 2013-10)
High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ...
Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)
The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
Symmetry energy of nuclear matter at low densities and clustering at the nuclear surface
(IOP Publishing Ltd, 2012)
We present a density functional theory which connects nuclear matter equation of state, which incorporates clustering at low densities, with clustering in medium and heavy nuclei at the nuclear surface. This explains the ...
Numerical analysis of velocity profile in a FFS microchannel
(AENSI Publisher All rights reserved, 2013-10)
Manipulation of the fluid flow behavior in microfluidic with precision technique is crucial to satisfy the needs of miniaturized systems. Velocity measurement is one of the physical phenomena plays significant role to ...
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)
As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)
Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
(Trans Tech Publications (TTP), 2013)
Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)
The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ...
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
FSS microchannel fluid flow profile investigation at high and low Re number
(AENSI Publisher All rights reserved, 2013-10)
The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ...