Browsing Zaliman Sauli, Lt. Kol. Professor Dr. by Author "vc.sundres@gmail.com"

Now showing items 1-11 of 11

    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...

    • Heat dissipation analysis under natural convection condition on high power LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...

    • Height measurement based on fringe projection 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Nor Shakirina, Nadzri; Veriven, Christopher John (Trans Tech Publications, 2014)
      A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ...

    • High power LED heat dissipation analysis via copper diamond slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...

    • Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Wei Wei, Ng (Trans Tech Publications, 2014)
      This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...

    • Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3 

      Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ...

    • LED heat dissipation study using different Cu slug size 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...

    • Shear ram speed characterization for copper wire bond shear test 

      Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz (Trans Tech Publications, Switzerland., 2012)
      This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...

    • Velocity profile investigation of FFS microchannel at Re 100 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...

    • Wettability and surface roughness study on RIE treated aluminium deposited surface 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Uda, Hashim, Prof. Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; Ramzan, Mat Ayub (Trans Tech Publications, 2014-04)
      Design of Experiment (DOE) is a technique for optimizing process which has controllable inputs and measurable outputs. As a method of DOE, 24 Full Factorial design is used to study the effect of Reactive Ion Etch towards ...

    • WSS investigation in microfluidic FFS channel at Re 500 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...