Browsing Mohd Mustafa Al Bakri Abdullah, Prof. Dr. by Subject "Average junction temperature"
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Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application
(Trans Tech Publications, 2013)Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...