Now showing items 1-3 of 3
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The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
Mazlan, Mohamed; A. Rahim; Iqbal, M. A.; Mohd Mustafa Al Bakri, Abdullah; Wan Yusra Hannanah, Wan Abdul Razak; Mohd Sukhairi, Mat Rasat (Trans Tech Publications, 2013)The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel ... -
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
Mazlan, Mohamed; A. Rahim; Mohd Mustafa Al-Bakri, Abdullah; Iqbal, M. A.; Wan Yusra Hannanah, Wan Abdul Razak; Mohammad Shahril, Salim (Trans Tech Publications, 2013)Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver ... -
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
Mazlan, Mohamed; A. Rahim; Iqbal, M. A.; Mohd Mustafa Al Bakri, Abdullah; Wan Yusra Hannanah, Wan Abdul Razak; Mohd Nor Hakim, Hassan (Trans Tech Publications, 2013)Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid ...