Modified corn cob filled chitosan biocomposite films

DSpace/Manakin Repository


Show simple item record Chan, Ming Yeng Salmah, Husseinsyah, Prof. Madya Ir. Dr. Sam, Sung Ting, Dr. 2014-06-19T08:49:14Z 2014-06-19T08:49:14Z 2013-11
dc.identifier.citation Polymer - Plastics Technology and Engineering, vol. 52(14), 2013, pages 1496-1502 en_US
dc.identifier.issn 0360-2559
dc.description Link to publisher's homepage at en_US
dc.description.abstract The present work was investigated the effect of filler content and chemical modification on mechanical, thermal properties and morphology study of CS/CC biocomposite films. The acrylic acid was used as chemical modification of corn cob. The increasing of CC content has decreased the tensile strength and elongation at break, but increased the modulus of elasticity of CS/CC biocomposite films. The modified corn cob with acrylic acid (AA) has enhanced the tensile properties and thermal properties of CS/CC biocomposite films by improving the interfacial interaction. The chemical reaction between acrylic acid and corn cob was confirmed by Fourier transmission infrared (FTIR) and the improvement of interfacial bonding was proven by scanning electron microscopy. en_US
dc.language.iso en en_US
dc.publisher Taylor and Francis Group, LLC. en_US
dc.subject Acrylic acid en_US
dc.subject Biocomposite en_US
dc.subject Chitosan en_US
dc.subject Corn cob en_US
dc.subject Films en_US
dc.title Modified corn cob filled chitosan biocomposite films en_US
dc.type Article en_US
dc.contributor.url en_US
dc.contributor.url en_US

Files in this item

This item appears in the following Collection(s)

Show simple item record

Search DSpace

Advanced Search


My Account