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dc.contributor.authorChan, Ming Yeng
dc.contributor.authorSalmah, Husseinsyah, Prof. Madya Ir. Dr.
dc.contributor.authorSam, Sung Ting, Dr.
dc.date.accessioned2014-06-19T08:33:51Z
dc.date.available2014-06-19T08:33:51Z
dc.date.issued2013-05
dc.identifier.citationBioResources, vol. 8(2), 2013, pages 2910-2923en_US
dc.identifier.issn1930-2126
dc.identifier.urihttp://ncsu.edu/bioresources/BioRes_08_2.html
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35715
dc.descriptionLink to publisher's homepage at http://ncsu.edu/en_US
dc.description.abstractCorn cob (CC) was used as a filler in chitosan (CS) biopolymer films. The effect of glutaraldehyde (GLA) as a crosslinking agent was studied in an effort to improve the properties of CS/CC biocomposite films prepared via solvent casting. The tensile strength and elongation at break values decreased, but the modulus of elasticity increased with CC content. However, the tensile properties of CS/CC biocomposite films improved when modified with GLA. The Fourier transform infrared (FTIR) results indicated the presence of imine bonds (C=N) and ethylenic groups due to the cross-linking reaction between CS and GLA. The thermal stability of CS/CC biocomposite films reduced with increasing CC content. The modification of CS/CC with GLA enhanced the thermal stability of the biocomposite films. Moreover, the wettability and adhesion of the CC-CS system were enhanced by modification with GLA, as demonstrated by a morphological study. The crosslinking agent glutaraldehyde positively affected the tensile strength, modulus of elasticity, and thermal stability of the biocomposite films.en_US
dc.language.isoenen_US
dc.publisherNorth Carolina State Universityen_US
dc.subjectBiocompositeen_US
dc.subjectChitosanen_US
dc.subjectCorn coben_US
dc.subjectFilmsen_US
dc.subjectGlutaraldehydeen_US
dc.titleChitosan/corn cob biocomposite films by cross-linking with glutaraldehydeen_US
dc.typeArticleen_US
dc.contributor.urlirsalmah@unimap.edu.myen_US
dc.contributor.urlstsam@unimap.edu.my en_US


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