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Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
(MDPI AG, 2021-02)
This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ...
Microstructure evolution of Ag/TiO₂ thin film
(MDPI AG, 2021-01)
Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ...
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...
Effect of graphene oxide on microstructure and optical properties of TiO₂ thin film
(IOP Publishing Ltd, 2019-12)
GO/TiO₂ thin films have been synthesized from titanium (IV) isopropoxide (TTIP) by a sol-gel method. The films were deposited onto a glass substrate using spin coating deposition technique then were subjected to annealed ...
Synthesis and charactherization of TiO₂ doped SnO₂ thin film prepared by sol-gel method
(IOP Publishing Ltd, 2019-12)
In this work, preparation of titanium dioxide doped with tin oxide, SnO₂/TiO₂ thin films deposited onto silicon wafer via sol-gel method. Different amount of SnO₂ was added (5 ml, 10ml and 15 ml) into parent solution. The ...
Microstructural studies of doped PEG Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-12)
Ag/TiO₂ thin film was prepared by the sol-gel method through the hydrolysis of titanium tetraisopropoxide and silver nitrate solution. Various amount of PEG was doped into the solution preparation to study the effect on ...
A review of geopolymer ceramic as a potential reinforcement material in solder alloys
(IOP Publishing Ltd, 2019-12)
Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been ...
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
(IOP Publishing Ltd, 2017-06)
In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of ...
Microstructure and wettability of Graphene Oxide/TiO2 thin film prepared via sol-gel method
(IOP Publishing Ltd, 2019-08)
The microstructure of graphene oxide TiO2 (GO/TiO2) films on wettability and morphology properties were studied at different amount of Titanium isopropoxide with fixed amount of GO. GO/TiO2 thin films were prepared by using ...
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
(IOP Publishing Ltd, 2019-12)
The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was ...