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Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)
Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)
Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
The effects of tensile and morphological properties of Styrene Butadiene Rubber/Recycled Chloroprene Rubber (SBR/CRr) blends
(Scientific.Net, 2012-12)
The effects of tensile and morphological properties of styrene butadiene rubber/virgin chloroprene rubber blends (SBR/CRv) and styrene butadiene rubber/recycled chloroprene rubber blends (SBR/CRr) were investigated. The ...
Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
(Macao Innovation & Invention Association, 2012-06-29)
Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.