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Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
(Macao Innovation & Invention Association, 2012-06-29)
Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.
Insight on the structural aspect of ENR-50/TiO2 hybrid in KOH/C3H8O medium revealed by NMR spectroscopy
(Elsevier, 2020)
The ring-opening reactions (ROR) of epoxide groups in epoxidized natural rubber/titania (ENR-50/TiO2) hybrid in potassium hydroxide/isopropanol medium were examined using NMR spectroscopy and supported by the FTIR technique. ...