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Thermal properties of different recycled acrylonitrile-butadiene rubber glove (NBRr) size and its blend ratios on SBR/NBRr blends
(Trans Tech Publications, 2013-09)
The effects of SBR/NBRr blends on thermal properties of such thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC) were carried out. Results showed that by incorporating the smallest size NBRr ...
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
(Trans Tech Publications, 2014)
Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ...
Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)
Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)
Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
The effects of tensile and morphological properties of Styrene Butadiene Rubber/Recycled Chloroprene Rubber (SBR/CRr) blends
(Scientific.Net, 2012-12)
The effects of tensile and morphological properties of styrene butadiene rubber/virgin chloroprene rubber blends (SBR/CRv) and styrene butadiene rubber/recycled chloroprene rubber blends (SBR/CRr) were investigated. The ...
Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
(Macao Innovation & Invention Association, 2012-06-29)
Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
(Trans Tech Publications, 2013)
Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...
High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube
(Trans Tech Publications, 2013)
A coal fired power plant with its normal operation temperature of 540°C in which its steam trap bypass tube in that power plant was totally fractured. The aim of this study is to explore the evidence related to the steam ...
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
(Trans Tech Publications, 2013)
The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ...