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| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 155 |
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| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
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| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 4 | 1 | 10 | 2 | 6 | 9 | 1 |
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| Referrences and Appendix.pdf | 4 |
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| Literature review.pdf | 2 |
| Methodology.pdf | 1 |
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