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| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 142 |
Total Visits Per Month
| September 2024 | October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | |
|---|---|---|---|---|---|---|---|
| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 1 | 4 | 1 | 10 | 2 | 3 | 0 |
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| Results and discussion.pdf | 3 |
| Introduction.pdf | 3 |
| Referrences and Appendix.pdf | 1 |
| Conclusion.pdf | 1 |
| Methodology.pdf | 1 |
| Literature review.pdf | 1 |
| Abstract, Acknowledgement.pdf | 1 |
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