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Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
(Trans Tech Publications Ltd., 2016-07)
This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ...