Show simple item record

dc.contributor.authorWan Nur Fadilla, Wan Hamad
dc.date.accessioned2014-04-01T01:37:48Z
dc.date.available2014-04-01T01:37:48Z
dc.date.issued2011
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33278
dc.description.abstractEpoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density, mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters, the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subjectEpoxy foamen_US
dc.subjectCompositesen_US
dc.subjectStructural analysis (Engineering)en_US
dc.subjectSodium bicarbonateen_US
dc.titleThe effect of the processing conditions on the mechanical and dielectric properties of epoxy foamen_US
dc.typeThesisen_US


Files in this item

Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record