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Now showing items 11-16 of 16
Fatigue failure analysis using the theory of critical distance
(Trans Tech Publications, 2011)
This paper explores the initial potential of theory of critical distance (TCD) which offers essential fatigue failure prediction in engineering components. The intention is to find the most appropriate TCD approach for a ...
Computation of stress intensity factor for multiple cracks using singular finite element
(Trans Tech Publications, 2011)
The simplification of two dimensional approaches in singular finite elements has promoted the method to be used in the formulation of stress intensity factor (SIF) of multiple cracks in finite body. The effect of shielding ...
Computation of stress intensity factor for multiple cracks using singular finite element
(International Association of Computer Science and Information Technology (IACSIT), 2011-03-25)
The simplification of two dimensional approaches in singular finite elements has promoted the method to be used in the formulation of stress intensity factor (SIF) of multiple cracks in finite body. The effect of shielding ...
J-integral analysis of surface cracks in round bars under combined loadings
(Trans Tech Publications, 2011-02)
This paper presents a non-linear numerical investigation of surface cracks in round bars under combined bending and torsion loadings by using ANSYS finite element analysis (FEA). Due to the non-symmetrical analysis, a full ...
Mode III stress intensity factors of surface crack in round bars
(Trans Tech Publications, 2011-02)
This study presents a numerical investigation on the stress intensity factors (SIF), K of surface cracks in round bars that were obtained under pure torsion loadings or mode III. ANSYS finite element analysis (FEA) was ...
Dicing die attach film for 3D stacked die QFN packages
(IEEE Conference Publications, 2012)
The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...