Now showing items 25-44 of 45

    • Optimization of EDM process parameters using Taguchi method 

      Azizul, Mohamad; Arshad, Noor Siddiquee; Ghulam, Abdul Quadir (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      This paper presents investigation and optimization of Electric Discharge Machining (EDM) parameters using Taguchi method. Three process parameters chosen were Pulse on-time (Ton), Duty factor and Discharge current (or pulse ...
    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...
    • Optimization of liquid cooling fins in microelectronic packaging 

      Ng, N. T.; Lai, K. W.; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Taylor & Francis Online, 2005)
      The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...
    • Optimization of PCB component placement using genetic algorithm 

      Jeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (World Scientific Publishing, 2002)
      This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...
    • Optimization of thermal resistance of stacked micro-channel using genetic algorithms 

      Jeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...
    • Performance of gas turbine cycle for combined cycle power plant 

      Mohd Khusairy, Khadzir (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-05)
      The gas turbine based power plant is characterized by its relatively low capital cost compared with the steam power plant. It has environmental advantages and short construction lead time. However, conventional industrial ...
    • Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages 

      Ghulam, Abdul Quadir, Prof. Dr.; Leong, C.B.; Krishnan, G.M.; Seetharamu, Kankanhally N. (IEEE Conference Publications, 2000)
      In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ...
    • Plant based energy potential and biomass utilization in Malaysia 

      Lee, Koon Ong; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Quadir, Prof. Dr.; Mohd Zulkifly, Abdullah (Regional Energy Resources Information Center (RERIC), 2000-12)
      The paper assesses the energy productivity of the major plantation crops in Malaysia as well as the status of bioenergy utilization in the country. Of the crops studied and under present local cultivation practices, oil ...
    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...
    • A quick and accurate estimation of heat losses from a cow 

      Khan, Zahid A.; Irfan Anjum, Badruddin; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The mathematical model available in the literature to calculate the skin temperature required to determine the heat loss from the body of an average cow under different environmental and skin-wetness conditions is complex ...
    • Steady and unsteady thermal analysis of a triple stack cold plate with heat losses 

      Beh, Shiao Lin; Ooi, Chen Hee; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Emerald Group Publishing Limited, 2005)
      Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ...
    • Steady state finite element analysis of a double stack cold plate with heat losses 

      Ghulam, Abdul Quadir, Prof. Dr.; Beh, Shiao Lin; Seetharamu, Kankanhally N.; Ahmad Yusoff, Hassan (Springer-Verlag, 2003)
      A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ...
    • Taguchi based grey relational analysis for multi-performance optimization of slab milling process parameters 

      Arshad, Noor Siddiquee; S. F. Khan; Ghulam, Abdul Quadir; Zahid A. Khan; Pankul, Goel; Shahrul, Kamaruddin (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      Taguchi based grey relational analysis is used to optimize multi-performance characteristic of CNC slab milling process parameters for machining ASTM A572 grade 50 high strength low alloy (HSLA) steel plates. Four process ...
    • Temperature cycling analysis for ball grid array package using finite element analysis 

      Muhammad Nubli, Zulkifli; Zul Azhar, Zahid Jamal, Dato, Prof. Dr.; Ghulam, Abdul Quadir, Prof. Dr. (Emerald Group Publishing Limited, 2011)
      Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...
    • Temperature cycling analysis for ball grid array package using finite element analysis 

      Muhammad Nubli, Zulkifli; Zul Azhar, Zahid Jamal, Prof. Dr.; Ghulam, Abdul Quadir (Emerald Group Publishing Limited, 2011)
      Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...
    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...
    • Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM 

      Hegde., Pradeep G.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Aswatha Narayana, P. A.; Mohd Zulkifly, Abdullah; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ...
    • Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan (Emerald Group Publishing Limited, 2004)
      This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
    • Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms 

      Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...
    • Thermal management of multichipmodule (MCM) using genetic algorithms 

      Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2003)
      The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...