Browsing Ghulam Abdul Quadir, Prof. Dr. by Title
Now showing items 35-45 of 45
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Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
(Emerald Group Publishing Limited, 2005)Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ... -
Steady state finite element analysis of a double stack cold plate with heat losses
(Springer-Verlag, 2003)A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ... -
Taguchi based grey relational analysis for multi-performance optimization of slab milling process parameters
(Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)Taguchi based grey relational analysis is used to optimize multi-performance characteristic of CNC slab milling process parameters for machining ASTM A572 grade 50 high strength low alloy (HSLA) steel plates. Four process ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ... -
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ... -
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ... -
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ... -
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ... -
Thermal management of multichipmodule (MCM) using genetic algorithms
(IEEE Conference Publications, 2003)The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ... -
Transient analysis of a liquid solar collector
(Elsevier Ltd., 2005)An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for ...