Now showing items 7-26 of 45

    • Design and fabrication of a multi-tube heat exchanger 

      Mohd Zaim, Mohd Zukeri (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-04)
      Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...
    • Design and fabrication of triple concentric pipe heat exchanger 

      Saqab, S. Jarallah; Quadir, G.A. (Universiti Malaysia Perlis, 2009-10-11)
      The objective of this piper is to dsign and fabricate a triple concentric-pipe heat exchanger to be used for the fluid flow and heat transfer analysis of parallel flow and counter flow arrangement of fluids. The three ...
    • Experimental investigation of a downdraft biomass gasifier 

      Zainal Alimuddin, Zainal Alauddin, Dr.; Ali, Rifau; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)
      An experimental investigation of a downdraft biomass gasifier is carried out using furniture wood and wood chips. The effect of equivalence ratio on the gas composition, calorific value and the gas production rate is ...
    • Experimental investigation of the performance of a triple concentric pipe heat exchanger 

      Quadir, Abdul Quadir, Prof. Dr.; Jarallah, Saqab S.; Ahmed, Naveed J Salman; Badruddin, I. A. (Elsevier Ltd., 2013)
      The performance of a triple concentric pipe heat exchanger is studied experimentally under steady state conditions for two different flow arrangements, called N-H-C and C-H-N, and for insulated as well as non-insulated ...
    • Fast transient solution of a two-layered counter-flow microchannel heat sink 

      Beh, S. L.; Tio, K. -K.; Ghulam, Abdul Quadir; Seetharamu, K. N. (Emerald Group Publishing Limited., 2009)
      Purpose: The purpose of this paper is to apply asymptotic waveform evaluation (AWE) to the transient analysis of a two-layered counter-flow microchannel heat sink. Design/methodology/approach: A two-layered counter-flow ...
    • Fast transient solutions for heat transfer [FEM] 

      Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo (IEEE Conference Publications, 2003)
      The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...
    • Fast transient thermal analysis of Fourier and non-Fourier heat conduction 

      Loh, J. S.; Abdul Azid, Ishak; Seetharamu, Kankanhally N.; Quadir, Ghulam Abdul (Elsevier Ltd., 2007-10)
      In this paper, asymptotic waveform evaluation (AWE) has been successfully used for fast transient characterization of Fourier and non-Fourier heat conduction. The Fourier and non-Fourier equations are reduced to a system ...
    • FEM analysis and experimental validation of flashless cold forging of autonomous underwater vehicle hubs 

      Khaleed, H.M.T.; Z., Samad; A.R., Othman; M.A., Mujeebu; Hussaini, A.; A.B., Abdullah; Magami, I.B.; Salman Ahmed, N.J.; Quadir, G.A.; Jeevan, Kanesan (Universiti Malaysia Perlis, 2009-10-11)
      In this paper three-dimensional FEM analysis and experimental flashless cold forging of aluminum front and back hubs of Autonomous Underwater Vehicle (AUV) propeller is presented. The rigid-plastic finite element simulation ...
    • FEM analysis of multifluid heat exchangers 

      Seetharamu, Kankanhally N.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Krishnan, Ganapathi M. (Emerald Group Publishing Limited, 2004)
      Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...
    • Finite element modelling of solidification phenomena 

      Seetharamu, Kankanhally N.; Paragasam, R.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Prasad, B. S.; Sundararajan, Thirumalachari (Springer India, 2001)
      The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ...
    • Flip chip thermal test vehicle design: Requirements, evaluations, and validations 

      Goh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (ASME, 2003)
      This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...
    • Flow analysis for flip chip underfilling process using characteristic based split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2004)
      In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...
    • Flow analysis for powered inhaler accessory device 

      Mohd Salleh, Abd Rahim (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-05)
      The aim of the study is to analyze the flow characteristics of the powered inhaler accessory device (PIAD), ranging from vortex development and two phase mixture of the inhaler drug. Computational Fluid Dynamics (CFD) ...
    • Heat transfer analysis in an annular cone fixed with saturated porous medium 

      Ghulam, Abdul Quadir, Assoc. Prof. Dr.; Salman Ahmed, N. J.; Irfan Anjum, Badruddin; Sarfaraz, Kamangar; Zainal Alimuddin, Zainal Alauddin, Dr. (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      The present work concerns with the heat transfer by natural convection and radiation in an annular cone fixed with saturated porous medium. The Darcy model is used to predict the heat transfer behavior in the porous ...
    • Modeling of wire-on-tube heat exchangers using finite element method 

      Ghulam, Abdul Quadir, Prof. Dr.; Krishnan, Ganapathi M.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)
      Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ...
    • Numerical analysis and experimental investigation into the performance of a wire-on-tube condenser of a retrofitted refrigerator 

      Ameen, Ahmadul; Mollik, , S. A.; Mahmud, Khizir; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The present paper discusses (a) the analysis of a wire-on-tube condenser under varying operating conditions of free convection using FEM, and (b) experimental verification of the performance of two wire-on-tube condensers ...
    • Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines 

      Rajagopal, M. S.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Taylor and Francis Group, LLC, 2002)
      Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ...
    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...
    • Optimization of EDM process parameters using Taguchi method 

      Azizul, Mohamad; Arshad, Noor Siddiquee; Ghulam, Abdul Quadir (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      This paper presents investigation and optimization of Electric Discharge Machining (EDM) parameters using Taguchi method. Three process parameters chosen were Pulse on-time (Ton), Duty factor and Discharge current (or pulse ...
    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...