Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

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dc.contributor.author Aida Fakhrul, Lamakasauk
dc.contributor.author Nurul Shakina, Surani
dc.contributor.author Mohd Arif Anuar, Mohd Salleh
dc.contributor.author Nik Noriman, Zulkepli, Dr.
dc.contributor.author Mohd Mustafa Al-Bakri, Abdullah
dc.contributor.author Rosniza, Hamzah
dc.contributor.author Mohamad, Abu Bakar
dc.date.accessioned 2013-07-25T05:32:05Z
dc.date.available 2013-07-25T05:32:05Z
dc.date.issued 2012-06-29
dc.identifier.uri http://hdl.handle.net/123456789/27113
dc.description The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China. en_US
dc.description.abstract Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. en_US
dc.language.iso en en_US
dc.publisher Macao Innovation & Invention Association en_US
dc.relation.ispartofseries Macau International Innovation & Invention Expo (IIEX) 2012 en_US
dc.subject Underfill material en_US
dc.subject Epoxy polymer en_US
dc.subject Epoxidized natural rubber en_US
dc.subject Polymer hybrid en_US
dc.title Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application en_US
dc.type Other en_US
dc.contributor.url arifanuar@unimap.edu.my en_US


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