| dc.contributor.author | Aida Fakhrul, Lamakasauk | |
| dc.contributor.author | Nurul Shakina, Surani | |
| dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
| dc.contributor.author | Nik Noriman, Zulkepli, Dr. | |
| dc.contributor.author | Mohd Mustafa Al-Bakri, Abdullah | |
| dc.contributor.author | Rosniza, Hamzah | |
| dc.contributor.author | Mohamad, Abu Bakar | |
| dc.date.accessioned | 2013-07-25T05:32:05Z | |
| dc.date.available | 2013-07-25T05:32:05Z | |
| dc.date.issued | 2012-06-29 | |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/27113 | |
| dc.description | The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China. | en_US |
| dc.description.abstract | Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Macao Innovation & Invention Association | en_US |
| dc.relation.ispartofseries | Macau International Innovation & Invention Expo (IIEX) 2012 | en_US |
| dc.subject | Underfill material | en_US |
| dc.subject | Epoxy polymer | en_US |
| dc.subject | Epoxidized natural rubber | en_US |
| dc.subject | Polymer hybrid | en_US |
| dc.title | Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application | en_US |
| dc.type | Other | en_US |
| dc.contributor.url | arifanuar@unimap.edu.my | en_US |
