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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
(Elsevier Science, 2006)
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
(American Institute of Physics, 2007-05-09)
This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ...