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    Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
    Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...

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    AuthorEhkan, Phaklen, Dr. (1)Fairul Afzal, Ahmad Fuad (1)Ong, Tee Say (1)Retnasamy, Vithyacharan (1)Vairavan, Rajendaran (1)... View MoreSubjectAnsys (1)
    Ball grid array (BGA) (1)
    Shear speed (1)Stress (1)... View MoreDate Issued2013 (1)

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