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    Polymer core BGA stress analysis at minimal vertical loading 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Steven, Taniselass; Norazeani, Abdul Rahman; Muhamad Hafiz, Ab Aziz (Trans Tech Publications, 2012-12)
    Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...

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    AuthorMuhamad Hafiz, Ab Aziz (1)Norazeani, Abdul Rahman (1)Retnasamy, Vithyacharan (1)Steven, Taniselass (1)Zaliman, Sauli, Dr. (1)SubjectBall grid array (1)
    BGA (1)
    Micropearl (1)... View MoreDate Issued2012 (1)

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