Browsing School of Microelectronic Engineering (Articles) by Subject "Zinc oxide"
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The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
(Science Publications, 2007)This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ... -
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...