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dc.contributor.authorChee, Pei Song
dc.contributor.authorRashidah, Arsat. Dr.
dc.contributor.authorTijjani Adam, Shuwa
dc.contributor.authorUda, Hashim, Prof. Dr.
dc.contributor.authorRuzairi, Abdul Rahim, Prof. Dr.
dc.contributor.authorLeow, Pei Ling
dc.date.accessioned2013-04-01T03:15:09Z
dc.date.available2013-04-01T03:15:09Z
dc.date.issued2012-09
dc.identifier.citationSensors (Switzerland), vol. 12 (9), 2012, pages 12572-12587en_US
dc.identifier.issn1424-8220
dc.identifier.urihttp://www.mdpi.com/1424-8220/12/9/12572
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/24195
dc.descriptionLink to publisher's homepage http://www.mdpi.com/en_US
dc.description.abstractThis paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz.en_US
dc.language.isoenen_US
dc.publisherMDPI, Basel, Switzerland.en_US
dc.subjectDiffuseren_US
dc.subjectElectromagnetic micropumpen_US
dc.subjectHot embossingen_US
dc.subjectLab on chipen_US
dc.titleModular architecture of a non-contact pinch actuation micropumpen_US
dc.typeArticleen_US
dc.contributor.urlpschee2@live.utm.myen_US
dc.contributor.urlrashidah@fke.utm.myen_US
dc.contributor.urltijjaniadam@yahoo.comen_US
dc.contributor.urluda@unimap.edu.myen_US
dc.contributor.urlruzairi@fke.utm.myen_US
dc.contributor.urlleowpl@fke.utm.myen_US


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