Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Microstructure"
Now showing items 1-5 of 5
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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
(Universiti Malaysia Perlis (UniMAP), 2020-05)Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ... -
Effect of milling time on the microstructure and dielectric properties of chitosan nanopowder
(Universiti Malaysia Perlis, 2020-01)The effect of milling time on the microstructure of chitosan nanopowder had been investigated. This study fabricated chitosan nanopowder via ball milling at different milling time. The milling time used were 0, 60, 180 and ... -
The evolutions of microstructure in pressureless Sintered Silver die attach material
(Universiti Malaysia Perlis (UniMAP), 2021-04)Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ... -
Influence of sintering temperature on density, hardness, shrinkage and microstructure of Alumina-Zirconia cutting tool
(Universiti Malaysia Perlis (UniMAP), 2021-08)The confederation of Alumina (Al2O3) and Zirconia (ZrO2) has emerged as a promising ceramic framework for advanced machine tool applications. The mechanical properties of the Al2O3-ZrO2 cutting tool are critically dependent ... -
Synthesis and Characterization of Structural, Magnetic and Electrical Properties of Ni–Mn–Zn Ferrites
(Universiti Malaysia Perlis (UniMAP), 2018-01)Polycrystalline ferrites (NiXMnZn1−XFe2O4) were synthesized by a conventional ceramic method and sintered at 1100°C for 4 hours. The structure and surface morphology of the samples were characterized by X‐ray diffraction ...