Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Electroplating"
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Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
(Universiti Malaysia Perlis (UniMAP), 2022-03)Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry mainly due to the complexity of package design. In most cases, controlling the plating thickness uniformity ...