Browsing School of Materials Engineering (Articles) by Subject "Average junction temperature"
Now showing items 1-2 of 2
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Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
(Trans Tech Publications, 2013)This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ... -
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application
(Trans Tech Publications, 2013)Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...