Browsing School of Materials Engineering (Articles) by Author "Noor Asikin, Ab Ghani"
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Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
Iziana, Yahya; Noor Asikin, Ab Ghani; Mohd Arif Anuar, Mohd Salleh; Hamidi, Abd Hamid; Zainal Arifin, Ahmad; Mayappan, Ramani (Scientific.Net, 2012-04-12)The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ... -
Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging
Noor Asikin, Ab Ghani; Iziana, Yahya; Mohd Arif Anuar, Mohd Salleh; Saidatulakmar, Shamsuddin; Zainal Arifin, Ahmad; Ramani, Mayappan (Scientific.Net, 2012-12)Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...