Browsing Uda Hashim, Prof. Ts. Dr. by Subject "Wirebonding"
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Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
(Hindawi Publishing Corporation, 2012)Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased ...