Browsing Uda Hashim, Prof. Ts. Dr. by Subject "Wire bonds"
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Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging (Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ...