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    • Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad 

      Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Uda, Hashim; Zaliman, Sauli (The Electrochemical Society, 2009-03-17)
      This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) ...