Now showing items 1-2 of 2

    • Characterization of intermetallic growth of gold ball bonds on aluminum bond pads 

      Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Mohammad Nuzaihan Md. Noor; Uda, Hashim (University of Malaya, 2008)
      In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...
    • Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad 

      Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Uda, Hashim; Zaliman, Sauli (The Electrochemical Society, 2009-03-17)
      This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) ...