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    • Characterization of intermetallic growth of gold ball bonds on aluminum bond pads 

      Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Mohammad Nuzaihan Md. Noor; Uda, Hashim (University of Malaya, 2008)
      In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...