Browsing Uda Hashim, Prof. Ts. Dr. by Subject "Flip chip technology"

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    • Under Bump Metallurgy (UBM)-a technology review for flip chip packaging 

      Mohd Khairuddin Md Arshad; Uda Hashim; Muzamir Isa (Department of Mechanical Engineering, University Malaya, 2007)
      Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ...