Browsing Uda Hashim, Prof. Ts. Dr. by Author "clgan_pgg@yahoo.com"
Now showing items 1-5 of 5
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Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
Gan, Chong Leong; Uda, Hashim, Prof. Dr. (Public Library of Science, 2013-11)This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness ... -
Influence of shear strength on long term biased humidity reliability of Cu ball bonds
Chong, Leong Gan; Uda, Hashim, Prof. Dr. (Springer Science+Business Media New York, 2014-10)This paper compares and discusses the influence of shear strength (in terms of shear-per mils-square) of Au and Cu ball bonds on the biased humidity reliability performance in SOIC 8LD leaded package. Biased (HAST) highly ... -
Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
Chong, Leong Gan; Uda, Hashim, Prof. Dr. (American Society of Mechanical Engineers (ASME), 2013)Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. ... -
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
Chong, Leong Gan; Uda (Springer Science+Business Media New York, 2013-08)Extended reliability and mechanical characterisation of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in semiconductor device packaging. This paper discusses the influence ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr. (Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ...