Browsing Uda Hashim, Prof. Ts. Dr. by Author "Chong, Leong Gan"
Now showing items 1-6 of 6
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Extended reliability of gold and copper ball bonds in microelectronic packaging
Chong, Leong Gan; Classe, Francis; Bak, Lee Chan; Uda, Hashim, Prof. Dr. (World Gold Council, 2013-06)Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ... -
Influence of shear strength on long term biased humidity reliability of Cu ball bonds
Chong, Leong Gan; Uda, Hashim, Prof. Dr. (Springer Science+Business Media New York, 2014-10)This paper compares and discusses the influence of shear strength (in terms of shear-per mils-square) of Au and Cu ball bonds on the biased humidity reliability performance in SOIC 8LD leaded package. Biased (HAST) highly ... -
Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
Chong, Leong Gan; Uda, Hashim, Prof. Dr. (American Society of Mechanical Engineers (ASME), 2013)Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. ... -
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
Chong, Leong Gan; Uda (Springer Science+Business Media New York, 2013-08)Extended reliability and mechanical characterisation of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in semiconductor device packaging. This paper discusses the influence ... -
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
Chong, Leong Gan; Classe, Francis; Uda, Hashim, Prof. Dr. (Emerald Group Publishing Limited, 2013)Purpose - The purpose of this paper is to provide a systematic method to perform long-term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr. (Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ...