Now showing items 1-2 of 2

    • Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication 

      Muhamad Hafiz, Zan @ Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof.; Mohd Mustafa Al-Bakri, Abdullah; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)
      The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
    • Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder 

      Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Khairel Rafezi, Ahmad, Dr.; Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Zainal Arifin, Ahmad, Prof. Dr. (Trans Tech Publications, 2011-07-04)
      A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ...