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Extended reliability of gold and copper ball bonds in microelectronic packaging
(World Gold Council, 2013-06)
Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ...
Further optical properties of CdX (X¼ S, Te) compounds under quantum dot diameter effect: Ab initio method
(Elsevier Ltd., 2012-09)
For energy band calculations, the indirect energy gap (G X) is calculated using density functional theory
(DFT) of the full potential-linearized augmented plane wave (FP-LAPW) method as implemented in
WIEN2K code. The ...
Fabrication and characterization of 50 nm silicon nano-gap structures
(American Scientific Publishers, 2011-04)
A simple method for the fabrication of nano-gaps less than 50 nm by using conventional photolithography combined with patterned-size reduction techniques is presented. Silicon material is used to fabricate the nano-gap ...
Theoretical and experimental study towards fabrication of nanogap dielectric biosensor by reversed spacer lithography
(American Institute of Physics, 2010-03-11)
A reversed spacer patterning technology using a sacrificial layer and a chemical vapor deposition (CVD) spacer layer has been developed, and is demonstrated to achieve sub-50 nm structures with conventional dry etching. ...
Precise alignment of individual single-walled carbon nanotube using dielectrophoresis method for development and fabrication of pH sensor
(Hindawi Publishing Corporation, 2013)
Development and fabrication of single-walled carbon nanotube (SWNT) based pH sensor were reported. The precise alignment of individual SWNT using dielectrophoresis method between the two microgap electrodes was conducted, ...
Modeling development of a high-sensitivity escherichia coli O157:H7 detection based on SH SAW sensor
(Trans Tech Publications, 2014-04)
Surface acoustic waves based devices were initially developed for the telecommunication purpose such as signal filters and resonators. The acoustic energy is strongly confined on the surface of the surface acoustic waves ...
Wettability and surface roughness study on RIE treated aluminium deposited surface
(Trans Tech Publications, 2014-04)
Design of Experiment (DOE) is a technique for optimizing process which has controllable inputs and measurable outputs. As a method of DOE, 24 Full Factorial design is used to study the effect of Reactive Ion Etch towards ...
Micropump pattern replication using Printed Circuit Board (PCB) technology
(Taylor and Francis Group, LLC., 2013-06-01)
This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal ...
Modular architecture of a non-contact pinch actuation micropump
(MDPI, Basel, Switzerland., 2012-09)
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in ...
The alignment of single SWNTs between electrode using dielectrophoresis
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
This paper presents the development and fabrication of electrical devices based on alignment of carbon nanotubes (CNTs) in single bundle of single-walled carbon nanotubes (sb-SWNTs) using dielectrophoresis (DEP). The Silicon ...