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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
Effect of space holder and compaction pressure on the porosity of sintered copper
(Trans Tech Publications, 2013)
The effect of space-holder content on the porosity of sintered copper that was fabricated by powder metallurgy technique has been investigated. Carbamide was used as space-holder and the content selected was 10 wt. %, 20 ...