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Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
(Universiti Malaysia Perlis (UniMAP), 2020-05)
Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful ...
The effect of temperature on the electrical conductivity and microstructure behaviour of silver particles
(Universiti Malaysia Perlis (UniMAP), 2020-05)
Silver conductive ink has been used in the electronics industry due to their potential advantages such as high electrical conductivity and thermal conductivity. However, silver needs to undergo a curing process to reduce ...
The evolutions of microstructure in pressureless Sintered Silver die attach material
(Universiti Malaysia Perlis (UniMAP), 2021-04)
Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ...
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
(Universiti Malaysia Perlis (UniMAP), 2022-07)
Poor adhesion between mold compound and leadframe in integrated circuit packaging for automotive devices can cause serious reliability issue and degrade the package quality. This study aims to evaluate and understand the ...