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Now showing items 41-50 of 50
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
(Emerald Group Publishing Limited, 2013)
Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...
Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band
(Hindawi Publishing Corporation, 2013)
This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)
Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)
This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...
Film bulk acoustic wave resonator filter for Ku-band applications
(Trans Tech Publications (TTP), 2013)
The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ...
Design and simulation of film bulk acoustic wave resonator in kuband
(Trans Tech Publications, 2013)
This paper presents the design of a Film Bulk Acoustic Wave Resonators (FBARs) operating in Ku-band. The one-dimensional (1-D) numerical and the three-dimension (3-D) Finite Element Method (FEM) simulation results are ...
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
(AENSI Publisher All rights reserved, 2013-10)
Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ...
Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3
(AENSI Publisher All rights reserved, 2013-10)
It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ...