Now showing items 1-2 of 2

    • Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology 

      Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)
      Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...
    • The electroosmosis mechanism for fluid delivery in PDMS multi-layer microchannel 

      Tijjani Adam, Shuwa; Uda, Hashim, Prof. Dr.; Md. Eaqub, Ali, Dr.; Leow, Pei Ling (American Scientific Publishers All rights reserved., 2013-01)
      Here we reported on fabrication of multi-layer microstructures that takes the advantage of electroosmosis to mix fluids. Microlaboratories for biochemical applications often require rapid mixing of different fluid streams. ...