Browsing School of Materials Engineering (Theses) by Subject "Solder and soldering"
Now showing items 1-7 of 7
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Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
Nowadays, composite solder has gain researcher’s attention due to its promising improvement in physical and mechanical properties for lead free solder. This study was carried out to investigate the effect of SiC particle ... -
Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
The revolution of electronic applications which have been assembled in smaller parts, lighter and more functional, causes the solder to become crucial over the worlds. These classes of low melting point alloys must provide ... -
The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been ... -
Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2013)The excessive growth of intermetallic compound (IMC) layer on solder joints has become a challenging to the electronic packaging industry. Excessive IMC growth is a barrier for the reliability of solder joints and the ... -
Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used ... -
Hot air solder levelling (HASL) process parameters optimization for SN100CL
Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior ... -
Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
The usage of composite solder is one of the method in improving stability of the solder joints. Addition of certain particles such SiC to form a composite solder has been given greater attention since it can enhance the ...