Browsing School of Materials Engineering (Theses) by Author "Mohd Arif Anuar Mohd Salleh"
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Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
Najib Saedi, Ibrahim (Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2013)The excessive growth of intermetallic compound (IMC) layer on solder joints has become a challenging to the electronic packaging industry. Excessive IMC growth is a barrier for the reliability of solder joints and the ... -
Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
Flora, Somidin (Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2015)One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, ...