Browsing School of Materials Engineering (FYP) by Subject "Lead-Free solder"
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Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current ...