Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
Abstract
This study will investigate the effects of current stressing on intermetallic compound
growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder
composite solder joint for certain current stressing time.. Soldered wires will be set up on the
power supply with current 0.20 A and left for 2 weeks. The current stressing observed at 24
hours, 240 hours and 360 hours. The results should indicate that the IMC layers under high
current stressing increasing due to the joule heat produced by the current stressing. The IMC
layer of SAC solder and SAC/Activated carbon composite solder joint will be observed under
Scanning Electron Microscope and Optical Microscope (OM). While, the elemental analysis for
the atom in the appeared phases will be examined under Dipersive X-ray(EDX). Next, the result
of tensile test should show an improvement in the tensile strength of SAC solder and
SAC/Activated carbon for mechanical properties.
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