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Now showing items 31-40 of 1890
Iskandar: Projected growth 2006 to 2025
(Iskandar Regional Development Authority (IRDA), 2006)
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)
Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...
The study of morphological structure, phase structure and molecular structure of collagen-PEO 600K blends for tissue engineering application
(Science Publications, 2006)
A new material which is collagen/ poly (ethylene oxide) (PEO) blend was developed to determine its possibility as a promising material for tissue scaffold. PEO with average molecular weight of 600,000 and collagen originated ...
PM : I have my own style
(New Straits Times, 2006-02-16)
Jangan jadikan isu - PM
(Utusan Malaysia, 2006-05-22)
Jamaica bantu majukan sukan
(Berita Harian, 2006-05-04)
National auto policy to be unveiled soon
(New Straits Times, 2006-03-05)
Effect of various coupling agents on properties of alumina-filled PP composites
(SAGE Publications, 2006)
The effect of coupling agents on the properties of alumina-filled polypropylene (PP) has been studied. Several types of coupling agents such as silane Z-6020 ((Aminoethylaminopropyl) trimethoxysilane), 3-GPS (3-(Glycidyloxypropyl) ...
PM : Let's maintain harmony
(The Star, 2006-01-28)